View SL1ICS3001U_652812.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

INTEGRATED CIRCUITS
SL1 ICS30 01
I*CODE1 Label IC
Chip Specification
Product Specification Revision 2.1 Public 2000-05-02
Philips Semiconductors
I*CODE1 Chip Specification
Rev. 2.1
May 2000
1 Contents
1 2 CONTENTS DEFINITIONS 2.1 2.2 3 4 5 2 4
Life Support Applications .................................................................................................... 4 Abbreviations ........................................................................................................................ 4 5 5 6
SCOPE ORDERING INFORMATION FUNCTIONAL DESCRIPTION
5.1 Basic Features ....................................................................................................................... 6 5.2 Block Diagram of the IC....................................................................................................... 6 5.3 Memory Organisation........................................................................................................... 7 5.3.1 Serial Number................................................................................................................... 7 5.3.2 Write Access Conditions .................................................................................................. 7 5.3.3 Special Functions (EAS/QUIET)..................................................................................... 8 5.3.4 Family Code and Application Identifier........................................................................... 8 5.3.5 Configuration of delivered ICs......................................................................................... 8 6 7 MECHANICAL DIE SPECIFICATIONS MECHANICAL WAFER SPECIFICATIONS 7.1 7.2 8 9 10
Wafer Status ........................................................................................................................ 10 Backside Treatment ............................................................................................................ 10 11
DOCUMENTATION
8.1 Delivery Documentation..................................................................................................... 11 8.2 Fail-Die Identification......................................................................................................... 11 8.2.1 Ink Dot Specification...................................................................................................... 11 8.2.2 Wafer Mapping............................................................................................................... 11 9 QUALITY ASSURANCE 12
9.1 Electrical Acceptance Test................................................................................................. 12 9.2 Visual Inspection................................................................................................................. 12 9.2.1 After Wafer Final Test.................................................................................................... 12 9.2.2 After Sawing (Film Frame Carrier)................................................................................ 12 10 PACKING 13
10.1 Storage Recommendations ................................................................................................. 13 10.2 Possible Forms of Delivery ................................................................................................. 13 10.2.1 Packing of Unsawn Wafers............................................................................................ 13 10.2.2 Packing of Sawn Wafers ................................................................................................ 13
SL040521.doc/M Public Page 2 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
11
HANDLING RECOMMENDATIONS
14
11.1 Sawing .................................................................................................................................. 14 11.2 Die Attach............................................................................................................................. 14 11.3 Wire Bonding....................................................................................................................... 14 12 13 14 COIL SPECIFICATION ELECTRICAL SPECIFICATIONS HINTS FOR LABEL IC ENCAPSULATION 14 15 16
14.1 Protection against Visible Light......................................................................................... 16 14.2 Protection against UV Light............................................................................................... 16 14.3 Resistance to X-Rays .......................................................................................................... 16 15 INLET/LABEL CHARACTERISATION AND TEST 17
15.1 Characterisation of the Inlet/Label ................................................................................... 17 15.2 Final Test of the Inlet/Label............................................................................................... 17 16 17 18 19 APPENDIX A: DIE PLAN APPENDIX B: CLUSTER PLAN APPENDIX C: CLUSTER MAP APPENDIX D: WAFER MAP 18 19 20 21
SL040521.doc/M
Public
Page 3 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
2 Definitions
Data sheet status Objective specification Preliminary specification Product specification Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics section of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
2.1 Life Support Applications
These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so on their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
2.2 Abbreviations
ASCII CSC EAN EAS EEPROM EMI ETSI FCC FFC Hex IC ISM LSB MSB MTBF PCB PCM RF rms SNR UV American Standard Code for Information Interchange Cyclic Redundancy Check European Article Number Electronic Article Surveillance Electrically Erasable and Programmable Read Only Memory Electromagnetic Interference European Telecommunications Standards Institute Federal Communications Commission Film Frame Carrier Value in hexadecimal notation Integrated Circuit Industrial, Scientific, Medical Least Significant Bit or Byte Most Significant Bit or Byte Mean Time Between Failure Printed Circuit Board Process Control Module Radio Frequency Root Mean Square Serial Number Ultraviolet
SL040521.doc/M
Public
Page 4 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
3 Scope
This specification describes the electrical, physical and dimensional properties of unsawn and sawn wafers on FFC of I*CODE1 Label ICs on a Philips 6C15 IDFW process and is the base for delivery of tested I*CODE1 Label ICs. General recommendations are given for storage, handling and processing of wafers as well as assembly of labels.
Reference documents:
MIL-STD 883D Method 3023 MIL-STD 883D Method 3015 SNW-FQ-627 PICTOH-QS007 General Specification for 6" Wafer (Prod. Spec.) General Quality Specification I*CODE1 Label IC, Coil Design Guide
This product specification is valid for VCOL1V0 from mask revision P/B upwards.
4 Ordering Information
Following ordering options are available:
Type Name SL1 ICS30 01W/N5D SL1 ICS30 01U/N5D SL1 ICS30 01U/L6D Description Sawn wafer on foil (FFC), 150 m, inked and mapped Unsawn wafer, 150 m, inked and mapped Unsawn wafer, 525 m, mapped (not inked) Ordering Code 9352 644 66005 9352 644 65025 9352 644 64025
SL040521.doc/M
Public
Page 5 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
5 Functional Description
5.1 Basic Features
The I*CODE1 Label IC is a dedicated chip for intelligent label applications like logistics and retail (including EAS) as well as baggage and parcel identification in airline business and mail services. The I*CODE system offers the possibility of operating labels simultaneously in the field of the reader antenna (Anticollision). It is designed for long range applications. Whenever connected to a very simple and cheap type of antenna (as a result of the 13.56 MHz carrier frequency) made out of a few windings printed, winded, etched or punched coil the I*CODE1 Label IC can be operated without line of sight up to a distance of 1.5 m (gate width).
5.2 Block Diagram of the IC
The label requires no internal power supply. Its contactless interface generates the power supply and the system clock via the resonant circuitry by inductive coupling to the reader. The interface also demodulates data that are transmitted from the reader to the I*CODE Label, and modulates the electromagnetic field for data transmission from the I*CODE Label to the reader. Data are stored in a non-volatile memory (EEPROM). The EEPROM has a memory capacity of 512 bit and is organised in 16 blocks consisting of 4 bytes each (1 block = 32 bits). The higher 12 blocks contain user data and the lowest 4 blocks contain the serial number, the write access conditions and some configuration bits.
SL040521.doc/M
Public
Page 6 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
5.3 Memory Organisation
The 512 bit EEPROM memory is divided into 16 blocks. A block is the smallest access unit. Each block consists of 4 bytes (1 block = 32 bits). Bit 0 in each byte represents the least significant bit (LSB) and bit 7 the most significant bit (MSB), respectively.
Block 0 Block 1 Block 2 Block 3 Block 4 Block 5 Block 6 Block 7 Block 8 Block 9 Block 10 Block 11 Block 12 Block 13 Block 14 Block 15 Byte 0 SNR0 SNR4 F0 x x x x x x x x x x x x x Byte 1 SNR1 SNR5 FF x x x x x x x x x x x x x Byte 2 SNR2 SNR6 FF x x x x x x x x x x x x x Byte 3 SNR3 SNR7 FF x x x x x x x x x x x x x Serial Number (lower bytes) Serial Number (higher bytes) Write Access Conditions Special Functions (EAS/QUIET) Family Code/Application Identifier/User Data User Data : : : : : : : : : User Data
The values (in hexadecimal notation) shown in the table above are stored in the EEPROM after the wafer production process. The contents of blocks marked with `x' in the table are not defined at delivery.
5.3.1 Serial Number
The unique 64 bit serial number is stored in blocks 0 and 1 and is programmed during the production process. SNR0 in the table represents the least significant byte and SNR7 the most significant byte, respectively.
5.3.2 Write Access Conditions
The Write Access Condition bits in block 2 determine the write access conditions for each of the 16 blocks. These bits can be set only to 0 (and never be changed to 1), i.e. already write protected blocks can never be written to from this moment on. This is also true for block 2. If this block is set into write protected state by clearing of bits 4 and 5 at byte 0, no further changes in write access conditions are possible.
aMSB
Byte 0
LSBa
aMSB
Byte 1
LSBa
aMSB
Byte 2
LSBa
aMSB
Byte 3
LSBa
Block 2: Write Access Conditions for Block a
| | | | | | | | | | | | | | | | 1|1 1|1 0|0 0|0 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 1|1 | | | | | | | | | | | | | | | |
3 2 1 0 7
User Data
6
5
4
11
10
9
8
15
14
13
12
User Data
Special Write Funct. Access
Serial Number
..... ..... ..... ..... ..... ..... ..... ..... ..... .....
The ones in the 16 pairs of bits have to be cleared together if the corresponding block is wanted to be write protected forever (1|1 a write access enabled, 0|0 a write access disabled). Writing of bit pairs 1|0 or 0|1 to block 2 is not allowed! It is extremely important to be particularly careful when clearing the Write Access bits in block 2, as you can lose write access to all of the blocks on the label in case of a mistake. Of course you can use this feature to put the label into a hardware write protected state!
SL040521.doc/M Public Page 7 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
5.3.3 Special Functions (EAS/QUIET)
The Special Functions block holds the two EAS bits (Electronic Article Surveillance mode active a the label answers at an EAS command) as well as the two QUIET bits (QUIET mode enabled a the label is permanently disabled but can be activated again with the `Reset QUIET bit' command). The state of QUIET mode does not influence the functionality of the EAS command. The remaining 28 bits (greyed `x' in the following figure) are reserved for future use.
aMSB
Byte 0
LSBa
Byte 1
Byte 2
Byte 3
Block 3: Special Functions
| | | | | | | | | | | | | | | | x|x x|x q|q e|e x|x x|x x|x x|x x|x x|x x|x x|x x|x x|x x|x x|x | | | | | | | | | | | | | | | |
Quiet EAS
Quiet: EAS:
q|q = 1|1 a QUIET mode enabled e|e = 1|1 a EAS mode enabled
q|q = 0|0 a QUIET mode disabled e|e = 0|0 a EAS mode disabled
Writing of bit pairs 1|0 or 0|1 to block 3 is not allowed! Changing of the Write Access Control or Configuration must be done in secure environment (by reading the current value of the block and masking in the new values for bit positions that may be changed). The label must not be moved out of the communication field of the antenna during writing! We recommend to put the label close to the antenna and not to remove it during operation.
5.3.4 Family Code and Application Identifier
The I*CODE system offers the feature to use (independently) Family Codes and/or Application Identifiers with some reader commands (this allows for example the creation of `label families'). These two 8-bit values are located at the beginning of User Data (block 4) as shown in the following figure and are only evaluated if the corresponding bytes at the reader commands are unequal to zero. Only if both corresponding parameter bytes at the reader commands Anticollision/Select, EAS and Unselected Read, respectively, are set to zero, block 4 can be used for user data without restriction.
aMSB
Byte 0
LSBa
aMSB
Byte 1
LSBa
Byte 2
Byte 3
| | | | | | | | | | | | | | | | x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x x| x | | | | | | | | | | | | | | | | Family Code Application ID The greyed bytes are for customer usage as well as the remaining blocks (5 to 15) are.
Block 4: Family Code, Application ID
5.3.5 Configuration of delivered ICs
I*CODE1 Label ICs are delivered with the following configuration by Philips: * * * * * * Serial number is unique and read only Write Access Conditions allow to change all blocks (with the exception of both serial number blocks) Status of EAS mode is not defined Status of QUIET mode is not defined Family Code and Application Identifier are not defined User Data memory is not defined
As the status of QUIET mode is not defined at delivery, the first command to be executed on the I*CODE1 Label IC should be the Reset QUIET Bit command!
SL040521.doc/M Public Page 8 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
6 Mechanical Die Specifications
Designation: VCOL1V0 visible on each die location see attached die plan see attached die plan LA, LB TEST, VSS 130 m x 150 m 90 m x 90 m (the test pads are electrically neutral at sawn wafers) AlSiCu 1.4 m 1460 m x 1490 m 1380 m x 1410 m 25 m see attached die plan
Bond pad location: Bond pad size: Test pad size:
Bond pad metallisation material: Metallisation thickness: Die dimensions (incl. 80 m scribe line): Die dimensions (excl. scribe line): Tolerances for sawn dies: Pin identification: Passivation attributes:
The passivation is a protection of active areas against dust (particles) and humidity and general contamination (whole surface of the chip except for the bond pads). Top side passivation material: Passivation thickness: Oxynitride 1.6 m
Due to the glass-like physical properties careful handling and processing is required. Available die backside treatment: etched
SL040521.doc/M
Public
Page 9 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
7 Mechanical Wafer Specifications
For further information as described in the following chapters please refer to the following Philips documents: * Dicing Guidelines for Thin Wafers (< 200 m) * General Specification for 6" Wafer (Prod. Spec.) In case of doubt or inconsistency with the following chapters the above mentioned specifications are applicable. Designation: Wafer diameter: Die separation lane width: Electrical connection of substrate: each wafer is laser scribed with batch and wafer number 150 mm (6") 0.3 mm 80 m (Scribe line) VSS
Geometrically complete dies per wafer: approx. 7400 Orientation of dies relat. to wafer flat: Position of test structures: Wafer layout: Batch size: Process: see attached cluster map see attached cluster map see attached cluster map 24 wafers 6C15 IDFW
7.1 Wafer Status
* Tested, unsawn * Tested, sawn on FFC Minimum yield per lot: 30 %
7.2 Backside Treatment
Wafers can be delivered with a thickness of 525 m (untreated) or with 150 m 15 m (approx. 6 mil) grinded and etched backside.
SL040521.doc/M
Public
Page 10 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
8 Documentation
8.1 Delivery Documentation
Each wafer container and each larger shipment container is individually marked with the identification information as follows: * * * * * Diffusion Batch number (wafer lot number) Part designation (type) with revision number Ordering code (see chapter 4) Date code of lot acceptation Good die quantity
The print out of the final test results is attached to the packing and contains the good die quantity related to every wafer number.
8.2 Fail-Die Identification
Every die is electrically tested according to data sheet. Identification of chips, which do not confirm with the electrical parameters of the data sheet is done by inking and/or wafer mapping (all dies at wafer periphery are identified by `FAIL').
8.2.1 Ink Dot Specification
Diameter: Height: Colour: Position: Attributes: min. 0.4 mm max. 20 m black central third of die (x, y direction) opaque, water resistant
NOTE: Uncompleted dies with an area < 95 % (wafer periphery) are not inked!
8.2.2 Wafer Mapping
Wafer mapping for failed die identification is available on Floppy-Disk. Format: Electroglas ESC-ASCEND on 3.5 Floppy-Disk
NOTE: The wafer map refers to unsawn wafers. At sawn wafers (on FFC) additional ICs might be inked (marked as fail) if damaged during the sawing process (compared to wafer map)! See Appendix D for an example of the wafer map.
SL040521.doc/M
Public
Page 11 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
9 Quality Assurance
9.1 Electrical Acceptance Test
The electrical acceptance test is performed in line (`sampling on the fly') according to the test specifications. Sampling plan: according General Quality Specification
9.2 Visual Inspection
9.2.1 After Wafer Final Test
Performed according document SNW-FQ-627. Sampling plan: according General Quality Specification
9.2.2 After Sawing (Film Frame Carrier)
Performed according document PICTOH-QS007. Sampling plan (3 wafers per lot): accept 0/3
SL040521.doc/M
Public
Page 12 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
10 Packing
The packing for shipment of wafers has to protect the wafers against shock, severe impact, dust and electrostatic discharge. The packing of unsawn wafers or sawn wafers is done according to Philips `General Specification for 6" Wafer (Prod. Spec.)'.
10.1 Storage Recommendations
Unsawn/sawn wafers should be kept in their original packing whilst in storage. Recommended storage conditions: Temperature: Climate atmosphere: Duration of storage: 15 ... 25 C 40 ... 60 % r.h. or dried N2 (only unsawn wafers!) max. 6 months
Deviating requirements have to be arranged between customer and Philips Semiconductors.
10.2 Possible Forms of Delivery
10.2.1 Packing of Unsawn Wafers
Delivery form: wafer box
10.2.2 Packing of Sawn Wafers
Delivery form: Foil thickness: Foil material: Film Frame Carrier (standard Philips carrier type P7) 0.55 ... 0.85 mm sticky foil
SL040521.doc/M
Public
Page 13 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
11 Handling Recommendations
Please refer to Philips `General Specification for 6" Wafer (Prod. Spec.)' for the following items:
11.1 Sawing 11.2 Die Attach 11.3 Wire Bonding
12 Coil Specification
The I*CODE1 Label IC has to be connected at pads LA, LB to a coil characterised by its electrical parameters according to Philips application note `SL1 ICS30 01 I*CODE1 Label IC, Coil Design Guide'.
SL040521.doc/M
Public
Page 14 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
13 Electrical Specifications
ABSOLUTE MAXIMUM RATINGS 1, 2
SYMBOL Tstg Tj VESD PARAMETER Storage Temperature Range Junction Temperature ESD Voltage Immunity
MIL-STD-883D, Method 3015.7, Human Body Model
TEST CONDITIONS
RATING - 55 to +140 - 55 to +140 2
UNIT C C kV peak
Imax LA-LB Maximum Input Peak Current mApeak 60 NOTES: 1. Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any conditions other than those described in the Operating Conditions and Electrical Characteristics section of this specification is not implied. 2. This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maxima.
OPERATING CONDITIONS
SYMBOL Tamb Tj op ILA-LB PARAMETER TEST CONDITIONS MIN - 25 - 25 TYP
1
MAX
+ 70 + 85
UNIT C C mArms Vpeak Vpeak Vpeak MHz
Operating Ambient Temperature Operating Junction Temperature Input Current 2 Minimum Supply Voltage VLA-LB rd for READ/EAS 2 Minimum Supply Voltage VLA-LB w r for WRITE 2 Minimum Supply Voltage VLA-LB fm for READ/EAS/WRITE
3
30 Standard Mode Standard Mode Fast Mode 3.1 3.6 5.2 3.7 4.1 6.5
fop Operating Frequency 13.553 13.560 13.567 NOTES: 1. Typical ratings are not guaranteed. These values listed are at room temperature. 2. The voltage between LA and LB is limited by the on-chip voltage limitation circuitry (corresponding to parameter ILA-LB). 3. Bandwidth limitation (7 kHz) according to ISM band regulations.
ELECTRICAL CHARACTERISTICS
Tamb = - 25 to +70 C
SYMBOL Cres Pmin mmin mmax tP sm tP fm tD R mod tret nwrite
PARAMETER Input Capacitance between LA - LB 3 Minimum Operating Supply Power Minimum Modulation of RF Voltage for Demodulator Response Maximum Modulation of RF Voltage for Demodulator Response Modulation Pulse Length 4 of RF Voltage Modulation Start-Pulse Length 4 of RF Voltage Demodulator Response Time Modulator ON Resistance EEPROM Data Retention EEPROM Write Endurance
2
TEST CONDITIONS VLA-LB = 2 Vrms VLA-LB = 2 Vrms
MIN 22.3
TYP
1
MAX 24.7
UNIT pF W % %
23.5 200 10
Vmax - Vmin m = Vmax + Vmin Vmax - Vmin m = Vmax + Vmin Standard Mode, m 10 % Fast Mode, m 10 % m 10 % ILA-LB = 30 mA Tamb 55 C
14
30 3.54 15.34 0.1 50 10 100 000 5.31
5
9.44 21.24 2.4 250
s s s Years Cycles
17.11 0.8 115
5
NOTES: 1. Typical ratings are not guaranteed. These values listed are at room temperature. 2. Measured with an HP4285A LCR meter at 13.56 MHz. 3. Including losses in resonant capacitor and rectifier. 4. The given values are derived from the 13.56 MHz system frequency. 5. Recommended values for pulse duration generated at the read/write device.
SL040521.doc/M Public Page 15 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
14 Hints for Label IC Encapsulation
14.1 Protection against Visible Light
As a result of the ultra low power design of the I*CODE1 Label IC some analogue circuits on the chip are light sensitive. This means that common sun light can impact the operation of the label if the chip is not protected against visible light radiation. Measurements have shown that a radiation of Emax = 60 W/m2 (spectrum: 400 to 1000 nm) causes a reduced operating range of the plain chip. Measurements of direct sunlight in summer deliver values up to 260 W/m2 . To ensure proper operation an expected minimum radiation reduction factor of approx. 9 (2 x 260/60 = 8.7) must be provided by the encapsulation. That means special care has to be taken to ensure a sufficient light protection of the I*CODE1 Label IC (e.g. non translucent encapsulation or underfiller, ...) according to application requirements.
14.2 Protection against UV Light
An EEPROM memory, as it is also used in the I*CODE1 Label IC, has some principle sensitivity to UV light (applies to EEPROM-technology in general). Thus strong UV exposure in the production of inlets/labels has to be avoided. UV protection has to be ensured using appropriate assembly methods.
14.3 Resistance to X-Rays
X-ray exposure on comparable Philips ICs (with even smaller feature size) caused neither a long term influence on the behaviour of the ICs nor on the data retention of the EEPROMs.
SL040521.doc/M
Public
Page 16 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
15 Inlet/Label Characterisation and Test
15.1 Characterisation of the Inlet/Label
The parameters recommended to be characterised for the inlet/label are:
Parameter Resonant frequency Symbol fres Conditions Resonant frequency @ Tamb = 22 C @ BTH
No command transmitted to the inlet/label a Label generates no response a No modulation
Threshold value for UNSELECTED READ command (standard mode) Threshold value for WRITE command (standard mode)
BTH
UNSELECTED READ command OK
BWR
WRITE (and Verifying READ) command OK
15.2 Final Test of the Inlet/Label
Basic flow for production and test: 1. 2. 3. 4. 5. 6. 7. Production of wafer Testing of dies on wafer Writing of serial numbers and pre-configuration Sawing of wafer Assembly of inlets/labels Final test of inlets/labels Writing of customer data
To detect damage of EEPROM cells during production of inlets/labels a final test of the EEPROM after assembly of the inlet/label is recommended. This is necessary to achieve lowest failure rates.
SL040521.doc/M
Public
Page 17 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
16 Appendix A: Die Plan
Measuring unit: m The two test pads (TEST and VSS) are electrically neutral at sawn wafers!
SL040521.doc/M
Public
Page 18 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
17 Appendix B: Cluster Plan
Measuring unit: mm
SL040521.doc/M
Public
Page 19 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
18 Appendix C: Cluster Map
The three black lines show the position of the PCM structures on the 6 inch wafer!
SL040521.doc/M
Public
Page 20 of 22
I*CODE1 Chip Specification
Rev. 2.1
May 2000
19 Appendix D: Wafer Map
The following screenshot shows an example of a wafer map:
Map file of this example:
ELECTROGLAS APPLICATIONS - WAFER TEST DATA FILE COPYRIGHT ASCEND LOT 09397 DEVICE VCOL1HE2 PRODUCT VCOL\4020 WAFER 05 READER 09397-05-B6 XSTEP 575 UNITS (0.1)MIL YSTEP 587 UNITS (0.1)MIL XREF 16891 UNITS (0.1)MIL YREF -261 UNITS (0.1)MIL XDELTA 0 YDELTA 0 FLAT 0 XFRST 21 YFRST 50 PRQUAD 1 COQUAD 1 DIAM 6000 UNITS MIL DATE 2000-01-23 TIME 15:30:00 OPERATOR 4020 SETUP FILE M:\SET\VCOL1HE2.SET TEST SYSTEM SYS VCOL\4020 TEST DATA PROBE CARD PC PROBER PIWP105 : : ### shortening of the file ### : : X40Y3 3 0 X41Y3 5 1 X42Y3 5 1 X43Y3 5 1 X44Y3 5 1 X45Y3 5 1 X46Y3 5 1 X47Y3 2 0 X48Y3 2 0 X49Y3 2 0 X50Y3 5 1 X51Y3 5 1 X52Y3 5 1 X53Y3 5 1 X54Y3 5 1 : : ### shortening of the file ### : : EDATE ETIME
SL040521.doc/M
Public
Page 21 of 22
Philips Semiconductors - a worldwide company
Argentina: see South America Australia: 34 Waterloo Road, North Ryde, NSW 2113, Tel. +61 2 9805-4455, Fax. +61 9 9805-4466 Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213, Tel. +43 1 60 101, Fax. +43 1 60 101 1210 Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6, 220050 MINSK, Tel. +375 172 200 733, Fax. +375 172 200 773 Belgium: see The Netherlands Brazil: see South America Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor, 51 James Bourchier Blvd., 1407 SOFIA, Tel. +359 2 689 211, Fax. +359 2 689 102 Canada: see United States Romania: see Italy China/Hong Kong: 501 Hong Kong Industrial Technology Centre, 72 Tat Chee Avenue, Kowloon Tong, Tel. +852 2811-9111, Fax. +852 2811-9173 Colombia: see South America Czech Republic: see Austria Denmark: Frederikskaj, Sydhavnsgade 23, DK-1780 Copenhagen V, Tel. +45 33 293333, Fax. +45 33 293905 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. +358 9 615800, Fax. +358 9 61580/xxx France: 51, Rue Carnot - BP317 92156 Suresnes Cedex, Tel. +33 1 40 99 6161, Fax. +33 1 40 996427 Germany Hammerbrookstrabe 69, D-20097 HAMBURG, : Tel. +49 40 23 53 60, Fax. +49 40 23 536 300 Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS, Tel. +30 1 4894 339/239, Fax. +30 1 4814 240 Hungary: see Austria India: Shivsagar Estate, Block 'A', Dr. Annie Besant Road, Worli, Mumbai-400 018, Tel. +91 22 492-1365, Fax. +91 22 493-8722 Indonesia : Gedung Philips, Jl. Buncit Raya Kav. 99-100, Jakarta 12510, Tel. +62 21 794-0040, Fax. +62 21 794-0080 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. +353 1 7640 000, Fax. +353 1 7640 200 Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 648 1007 Italy PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3, : 20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, Tokyo 108-8507, Tel. +81 3 3740-5130, Fax. +81 3 3740-5057 Korea: 260-199 Itaewon-dong, Yongsan-ku, Seoul, Korea C., P.O. Box 3680, Tel. +82 2 709-1412, Fax. +82 2 709-1415 Malaysia : 76 Jalan Universiti, 46200 Petaling Jaya, Selangor, Tel. +60 3 757 5214, Fax. +60 3 757-4880 Mexico: Philips Components, El Paso, Texas, Tel. +1 915 772-4020 Middle East : see Italy Singapore: Lorong One, Toa Payoh, Singapore 319762, Tel. +65 350-2538, Fax. +65 251-6500/250-6010 Slovakia : see Austria Slovenia: see Italy South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. +27 11 470 5911, Fax. +27 11 470 5494 South America : Al. Vicente Pinzon, 173 - 6th floor, 04547-130 Sao Paulo, SP - Brazil, Tel. +55 11 821 2333, Fax. +55 11 829 1849 Spain: Balmes 22, 08007 BARCELONA, Tel. +34 3 301 6312, Fax. +34 3 301 4107 Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM, Tel. +46 8 598 520 00, Fax. +46 8 632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. +41 1 488 2686, Fax. +41 1 481 7730 Taiwan R.O.C.: 6th Floor, No. 96, Chien Kuo North Road, Sec.1, Taipei, Tel. +886 2 2134-2865, Fax. +886 2 2134-2874 Thailand: 209/2 Sanpavuth-Bangna Road, Prakanong, Bangkok 10260, Tel. +66 2 745-4090 x3261, Fax. +66 2 398-0793 Turkey Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, : Tel. +90 212 279 2770, Fax. +90 212 282 6707 Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7, 252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461 United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421 United States: 811 East Arques Avenue, P.O. Box 3409, Sunnyvale, CA 94088-3409, Tel. +800 234 7381, Fax. +800 943 0087 Uruguay: see South America Vietnam: see Singapore Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD, Tel. +381 11 625 344, Fax.+381 11 635 777 Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW, Tel. +7 095 755 6918, Fax. +7 095 755 6919 Poland: Ul. Lukiska 10, PL 04-123 WARSZAWA, Tel. +48 22 612 2831, Fax. +48 22 612 2327 Portugal: see Spain Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB, Tel. +31 40 27 82785, Fax. +31 40 27 88399 New Zealand: 2 Wagener Place, Mt Albert, C.P.O.Box 1041, Auckland, Tel. +64 9 815-4144, Fax. +64 9 849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. +47 22 74 8000, Fax. +47 22 74 8341 Pakistan: see Singapore Philippines: 106 Valero Street, Salcedo Village, Makati City, Metro Manila, Tel. +63 2 816-6380, Fax. +63 2 817-3474
Published by: Philips Semiconductors Gratkorn GmbH, Mikron-Weg 1, A-8101 Gratkorn, Austria, Fax: +43 3124 299 270 For all other countries apply to: Philips Semiconductors, International Marketing & Sales Communications, Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax: +31 40 27 24825 Internet: http://www.semiconductors.philips.com (c) Royal Philips Electronics N.V. 2000 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

▲Up To Search▲

Price & Availability of SL1ICS3001U

	To Download SL1ICS3001U Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .